Next-generation Kontron high-performance embedded computer COBALT system at AUSA 2014 1310145

a
 
AUSA 2014 news coverage report show daily visitors exhibitors Annual meeting defense exposition exhibition conference Association United States Army October Washington D.C.
 
AUSA 2014
Association of the United States Army

AUSA Annual Meeting & Exposition
13 to 15 October 2014
Washington D.C., United States
 
Kontron at AUSA 2014
 
 
Monday, October 13, 2014 10:18 PM
 
Next-generation Kontron high-performance embedded computer COBALT system at AUSA 2014.
Kontron, a leading global provider of Embedded Computer Technology (ECT), today announced at the 2014 AUSA Annual Meeting and Exposition the availability of new I/O options with its next-generation Kontron high-performance embedded computer COBALT (Computer Brick Alternative) system to help reduce development costs and streamline the time to deployment.
     
Kontron, a leading global provider of Embedded Computer Technology (ECT), today announced at the 2014 AUSA Annual Meeting and Exposition the availability of new I/O options with its next-generation Kontron high-performance embedded computer COBALT (Computer Brick Alternative) system to help reduce development costs and streamline the time to deployment.
The highly scalable COBALT (COmputer Brick ALTernative) product family is based on the COMe module Basic & Compact form factor module (Type 6) with a specialized carrier board assembly.
     

The new I/O options are offered via COBALT’s advanced tightly-coupled mezzanine features, a ruggedized compact carrier board and System Interface Board (SIB). These basic modular and standards-based platform profiles match established development requirements for situational awareness, removable storage and combination processor/networking switch capabilities applicable to a wide range of ground, ship, avionics and unmanned military systems. The latest Kontron COBALT I/O options will be demonstrated at the Kontron AUSA booth #3543 at the Walter E. Washington Convention Center in Washington DC, October 13-16, 2014.

Facilitating development, COBALT features a configurable front panel for modular I/O profile options. Enhanced I/O is achieved through 1x XMC slot, 2x mPCIe full slot or 1x mPCIe full and 2x mPCIe half. These profile slots and front I/O panel allow full support for different profile options such as ARINC 429, MIL-STD-1553, combined L2/L3 GbE switch/processor, CANbus, Wi-Fi, WiMAX, 3G/4G modem, GPS, additional Serial Ports, FPGA, A/D and more.

The next-generation Kontron COBALT family offers a complete, rugged small form factor system. Ideal for the harshest environment operational demands of applications in many industries, Kontron designed the COBALT’s IP67 chassis to operate reliably in a multitude of conditions including extreme temperatures, shock, vibration and EMI. Powering the Kontron COBALT base system is a 3rd generation Intel® dual core-based COM Express® Type 6 module that features ECC, rapid shutdown design and 100% extended temperature screening with the option of removable or fixed SSDs and/or fixed mSATA storage. Windows, Linux and VxWorks operating system and software support packages are also available.

Meeting the military’s Size, Weight and Power (SWaP) requirements, the Kontron COBALT provides a low profile, fanless and fully enclosed system that provides efficient thermal management in a small 5.5 x 8.5 x 3.9-inch (140 x 216 x 99 mm) form factor weighing less than 6 pounds (2.7 kg). Furthermore, the carrier board design maximizes the system’s capabilities while minimizing its overall size and ensures reliable operation in higher temperature and shock and vibration conditions. COBALT is designed based on specifically-selected components from embedded roadmaps enabling Kontron to ensure long-term availability and minimizing the risk of unplanned design changes and unexpected application modification.

 

This website uses cookies to manage authentication, navigation, and other functions. By using our website, you agree that we can place these types of cookies on your device.