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New 3M Ultra Light Weight Ballistic Bump Helmet to Debut at AUSA 2014 1310146.
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AUSA
2014 Association of the United States Army AUSA Annual Meeting & Exposition 13 to 15 October 2014 Washington D.C., United States |
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3M at AUSA 2014 |
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Monday, October 13, 2014 10:40 PM | |||
New 3M Ultra Light Weight Ballistic Bump Helmet to Debut at AUSA 2014. | |||
For decades, special forces have been required to accept the trade-offs
in protection level, weight and comfort in helmets. Ceradyne Inc., a 3M
company, is helping eliminate such trade-offs with its new 3M Ultra Light
Weight Ballistic Bump Helmet (ULW-BBH), which meets bump and ballistic
operational requirements in a single, lightweight helmet. The helmet will
debut at AUSA, Oct. 13 to 15 in Washington, D.C. at 3M Booth 7329. |
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New 3M Ultra Light Weight Ballistic Bump Helmet (ULW-BBH) |
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The
ULW-BBH demonstrates 3M’s capability to lead the industry in achieving
the best performance-to-weight level in helmet development. The helmet
also meets the expectations of operators for comfort, fit and compatibility
with a multitude of devices. |